NVIDIA remains the center of AI training and high-end inference demand.
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Price
$205.19
1D change
+0.16%
Market cap
$4.97T
Sector
Technology
Instinct GPUs give hyperscalers a second-source path for AI training and inference.
Price
$511.57
1D change
+4.73%
Market cap
$834.17B
Sector
Technology
ASML is the sole supplier of EUV lithography systems used for the most advanced logic and memory nodes.
Price
$1.9K
1D change
-1.89%
Market cap
$718.25B
Sector
Technology
Most leading AI chips still depend on TSMC's manufacturing and advanced packaging.
Price
$423.93
1D change
+0.68%
Market cap
$2.20T
Sector
Technology
| Metric | NVDA | AMD | ASML | TSM |
|---|---|---|---|---|
| Price | $205.19 | $511.57 | $1.9K | $423.93 |
| 1D Change | +0.16% | +4.73% | -1.89% | +0.68% |
| Market Cap | $4.97T | $834.17B | $718.25B | $2.20T |
| Enterprise Value | $4.92T | $825.69B | $39.90T | $15.34T |
| Trailing P/E | 31.4 | 171.7 | 62.5 | 36.5 |
| Forward P/E | 16.1 | 39.0 | 38.9 | 21.7 |
| Price / Sales | 19.6 | 22.3 | 21.3 | 0.5 |
| EV / Revenue | 19.4 | 22.0 | 1,184.1 | 3.7 |
| Revenue Growth | 85.2% | 37.8% | 13.2% | 35.1% |
| Earnings Growth | 214.5% | 91.2% | 19.2% | 58.4% |
| Gross Margin | 74.1% | 53.1% | 52.6% | 61.9% |
| Operating Margin | 65.6% | 14.4% | 36.0% | 58.1% |
| Net Margin | 63.0% | 13.4% | 29.7% | 46.5% |
| ROE | 114.3% | 8.1% | 52.2% | 36.2% |
| Free Cash Flow | $46.34B | $7.17B | $8.24B | $719.16B |
| FCF Margin | 18.3% | 19.2% | 24.5% | 17.5% |
| Debt / Equity | 6.55x | 6.00x | 0.13x | 0.18x |
| Current Ratio | 3.44x | 2.73x | 1.36x | 2.49x |
| Dividend Yield | 49.00% | — | 46.00% | 90.00% |
| Next Earnings | Aug 26, 2026 | Aug 04, 2026 | Jul 15, 2026 | Jul 16, 2026 |
| Quarterly Revenue | $81.61B | $10.25B | $8.77B | $1.13T |
| Revenue QoQ | +19.8% | -0.2% | -9.8% | +8.4% |
| Quarterly Net Income | $58.32B | $1.38B | $2.76B | $572.48B |
| Net Income QoQ | +35.8% | -8.5% | -2.9% | +17.9% |
NVDA thesis lens
AI compute platform
Why it could benefit
- NVIDIA remains the center of AI training and high-end inference demand.
- Its stack includes chips, networking, systems, CUDA, and software libraries, not just GPUs.
- As models get larger and enterprises move into production, full-stack control becomes more valuable.
Moat / edge
- CUDA ecosystem and developer lock-in.
- Leading performance in accelerated computing.
- Integrated platform spanning silicon, interconnect, and software.
What to watch
- Supply-demand balance for each new architecture cycle.
- Mix shift between hyperscalers and enterprise customers.
- Competition from custom silicon and AMD.
Key risks
- Customer concentration and product-transition execution matter a lot.
- Any sharp slowdown in capex could compress expectations quickly.
AMD thesis lens
GPU/CPU AI accelerator challenger
Why it could benefit
- Instinct GPUs give hyperscalers a second-source path for AI training and inference.
- EPYC CPUs and adaptive compute help AMD participate across the AI server bill of materials.
- If open accelerator ecosystems broaden, AMD can gain share from customers avoiding single-vendor dependence.
Moat / edge
- High-performance CPU franchise and growing GPU roadmap.
- Deep relationships with hyperscalers, OEMs, and enterprise server buyers.
- Chiplet design capability and manufacturing partnership with TSMC.
What to watch
- Instinct shipment ramp and software maturity.
- Gross margin mix between CPUs, GPUs, gaming, and embedded.
- Cloud customer adoption versus Nvidia alternatives.
Key risks
- Nvidia's software ecosystem remains the hardest competitive hurdle.
- AI GPU demand can be lumpy if customer qualification slips.
ASML thesis lens
EUV lithography chokepoint
Why it could benefit
- ASML is the sole supplier of EUV lithography systems used for the most advanced logic and memory nodes.
- AI compute demand raises the need for leading-edge wafer capacity.
- Memory ramps such as advanced DRAM and HBM also pull on lithography intensity.
Moat / edge
- Unique EUV technology stack with deep supplier specialization.
- Entrenched customer relationships with leading-edge foundries and memory makers.
- Long development cycles make displacement extremely difficult.
What to watch
- EUV and High NA EUV order trends.
- China restrictions and shipment timing.
- Foundry and memory capex cycles.
Key risks
- Export controls can limit sales into key regions.
- Semicap cycles can create long drawdowns despite strong long-term positioning.
TSM thesis lens
Advanced semiconductor manufacturing
Why it could benefit
- Most leading AI chips still depend on TSMC's manufacturing and advanced packaging.
- As AI complexity rises, foundry leadership in yield, scale, and packaging matters more.
- TSMC is a cleaner way to own the ecosystem rather than one end-market winner.
Moat / edge
- Leading-edge process technology.
- Manufacturing scale and execution track record.
- Hard-to-replicate ecosystem trust with top chip designers.
What to watch
- Capacity additions in advanced nodes and CoWoS-type packaging.
- Geographic expansion and margin preservation.
- Mix between smartphone, HPC, and AI demand.
Key risks
- Geopolitical risk is always part of the TSMC thesis.
- Large customer concentration can amplify cycle swings.