Lam is a critical supplier for etch and deposition steps used in advanced memory and logic manufacturing.
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Price
$311.35
1D change
+1.82%
Market cap
$389.59B
Sector
Technology
| Metric | LRCX |
|---|---|
| Price | $311.35 |
| 1D Change | +1.82% |
| Market Cap | $389.59B |
| Enterprise Value | $387.74B |
| Trailing P/E | 54.1 |
| Forward P/E | 27.0 |
| PEG Ratio | 1.43x |
| Price / Sales | 16.8 |
| EV / Revenue | 16.7 |
| Revenue Growth | 30.0% |
| Earnings Growth | 34.7% |
| Gross Margin | 50.5% |
| Operating Margin | 37.4% |
| Net Margin | 31.3% |
| ROE | 65.1% |
| Free Cash Flow | $3.28B |
| FCF Margin | 14.1% |
| Debt / Equity | 0.30x |
| Current Ratio | 2.63x |
| Dividend Yield | 0.33% |
| Next Earnings | Oct 21, 2026 |
| Quarterly Revenue | $nan |
| Revenue QoQ | nan% |
| Quarterly Net Income | $nan |
| Net Income QoQ | nan% |
LRCX thesis lens
Etch and deposition for memory and logic
Why it could benefit
- Lam is a critical supplier for etch and deposition steps used in advanced memory and logic manufacturing.
- AI-driven HBM and DRAM demand can increase wafer starts and process complexity.
- More complex chip structures tend to raise etch and deposition intensity.
Moat / edge
- Strong position in memory process equipment.
- Large installed base and recurring service revenue.
- Technical depth in high-aspect-ratio etch and deposition.
What to watch
- Memory capex recovery.
- China exposure and export-rule changes.
- Advanced packaging and gate-all-around opportunities.
Key risks
- Memory spending is highly cyclical.
- Policy restrictions can interrupt demand in important markets.