Research Portal

U.S.-listed market research with live data and structured thesis notes.

Side-by-side research view

Compare names across metrics and research quality

Use up to 4 U.S.-listed names from this dashboard to compare valuation, growth, cash flow, balance-sheet strength, and the curated investment case in one place.

1 stocks in current compare
4 max names side by side
25 shared metrics lined up

Build a compare set

Enter comma-separated tickers from the dashboard universe. Duplicate tickers are ignored automatically.

Clear
Silicon Stack Data Center Fabric AI Software Power + Grid Robotics
LRCX Silicon, IP & Semicap

Lam Research

Etch and deposition for memory and logic

Detail page

Lam is a critical supplier for etch and deposition steps used in advanced memory and logic manufacturing.

Price $409.54
1D change +5.27%
Market cap $512.16B
Sector Technology

Shared metric table

Live market metrics plus reported quarterly revenue and profit QoQ rows.

Green and red only apply where direction is meaningful. Quarterly revenue and profit cells inherit the sign of the reported QoQ change, which can swing sharply when the prior quarter included a one-time item.

On smaller screens, swipe this table horizontally to compare the full set.

Metric LRCX
Price $409.54
1D Change +5.27%
Market Cap $512.16B
Enterprise Value $511.14B
Trailing P/E 77.6
Forward P/E 51.1
PEG Ratio 2.26x
Price / Sales 23.6
EV / Revenue 23.6
Revenue Growth 23.8%
Earnings Growth 40.8%
Gross Margin 50.0%
Operating Margin 35.0%
Net Margin 30.9%
ROE 66.8%
Free Cash Flow $4.35B
FCF Margin 20.1%
Debt / Equity 0.35x
Current Ratio 2.54x
Dividend Yield 25.00%
Next Earnings Jul 29, 2026
Quarterly Revenue $5.84B
Revenue QoQ +9.3%
Quarterly Net Income $1.83B
Net Income QoQ +14.5%

LRCX thesis lens

Etch and deposition for memory and logic

Why it could benefit

  • Lam is a critical supplier for etch and deposition steps used in advanced memory and logic manufacturing.
  • AI-driven HBM and DRAM demand can increase wafer starts and process complexity.
  • More complex chip structures tend to raise etch and deposition intensity.

Moat / edge

  • Strong position in memory process equipment.
  • Large installed base and recurring service revenue.
  • Technical depth in high-aspect-ratio etch and deposition.

What to watch

  • Memory capex recovery.
  • China exposure and export-rule changes.
  • Advanced packaging and gate-all-around opportunities.

Key risks

  • Memory spending is highly cyclical.
  • Policy restrictions can interrupt demand in important markets.