Advanced packaging is one of the real choke points in modern AI supply chains, and Amkor gives you direct exposure to that layer.
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Price
$93.55
1D change
+3.42%
Market cap
$23.19B
Sector
Technology
| Metric | AMKR |
|---|---|
| Price | $93.55 |
| 1D Change | +3.42% |
| Market Cap | $23.19B |
| Enterprise Value | $22.99B |
| Trailing P/E | 53.8 |
| Forward P/E | 38.2 |
| PEG Ratio | 0.76x |
| Price / Sales | 3.3 |
| EV / Revenue | 3.3 |
| Revenue Growth | 27.5% |
| Earnings Growth | 285.6% |
| Gross Margin | 14.4% |
| Operating Margin | 6.0% |
| Net Margin | 6.2% |
| ROE | 10.0% |
| Free Cash Flow | $-47.1M |
| FCF Margin | -0.7% |
| Debt / Equity | 0.35x |
| Current Ratio | 2.01x |
| Dividend Yield | 36.00% |
| Next Earnings | Jul 27, 2026 |
| Quarterly Revenue | $1.68B |
| Revenue QoQ | -10.8% |
| Quarterly Net Income | $83.4M |
| Net Income QoQ | -51.5% |
AMKR thesis lens
Advanced packaging bottleneck
Why it could benefit
- Advanced packaging is one of the real choke points in modern AI supply chains, and Amkor gives you direct exposure to that layer.
- As AI chips become more complex, packaging quality, yield, and capacity matter more to the final system.
- This is a good complement to TSMC because it broadens the packaging thesis beyond one foundry giant.
Moat / edge
- Scale and experience in outsourced semiconductor packaging and test.
- Relevance to advanced-node and heterogeneous packaging complexity.
- A specialized role in a part of the semiconductor stack that is hard to expand quickly.
What to watch
- Advanced packaging demand tied to AI and HPC programs.
- Capacity expansion and utilization.
- Customer mix and packaging-content growth per device.
Key risks
- Packaging demand can still follow broader semiconductor cycles.
- Returns depend on whether advanced packaging demand stays tight enough to support strong economics.