Advanced packaging is one of the real choke points in modern AI supply chains, and Amkor gives you direct exposure to that layer.
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Price
$55.27
1D change
+2.05%
Market cap
$13.70B
Sector
Technology
| Metric | AMKR |
|---|---|
| Price | $55.27 |
| 1D Change | +2.05% |
| Market Cap | $13.70B |
| Enterprise Value | $13.93B |
| Trailing P/E | 24.8 |
| Forward P/E | 19.6 |
| PEG Ratio | 0.76x |
| Price / Sales | 1.8 |
| EV / Revenue | 1.9 |
| Revenue Growth | 25.6% |
| Earnings Growth | 218.2% |
| Gross Margin | 15.5% |
| Operating Margin | 10.5% |
| Net Margin | 7.4% |
| ROE | 12.5% |
| Free Cash Flow | $-378.8M |
| FCF Margin | -5.1% |
| Debt / Equity | 0.57x |
| Current Ratio | 2.17x |
| Dividend Yield | 0.61% |
| Next Earnings | Oct 26, 2026 |
| Quarterly Revenue | $1.90B |
| Revenue QoQ | +12.7% |
| Quarterly Net Income | $173.8M |
| Net Income QoQ | +108.5% |
AMKR thesis lens
Advanced packaging bottleneck
Why it could benefit
- Advanced packaging is one of the real choke points in modern AI supply chains, and Amkor gives you direct exposure to that layer.
- As AI chips become more complex, packaging quality, yield, and capacity matter more to the final system.
- This is a good complement to TSMC because it broadens the packaging thesis beyond one foundry giant.
Moat / edge
- Scale and experience in outsourced semiconductor packaging and test.
- Relevance to advanced-node and heterogeneous packaging complexity.
- A specialized role in a part of the semiconductor stack that is hard to expand quickly.
What to watch
- Advanced packaging demand tied to AI and HPC programs.
- Capacity expansion and utilization.
- Customer mix and packaging-content growth per device.
Key risks
- Packaging demand can still follow broader semiconductor cycles.
- Returns depend on whether advanced packaging demand stays tight enough to support strong economics.